Optical alignments BGA rework machine, WDS-750 auto pick and place for all kinds of motherboard

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    2017-09-23 20:19

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Shenzhen Wisdomshow Technology Co Ltd







Haosi Western Industrial Park, Xihuan Rd., Bao'an district, Shenzhen, Guangdong, China (518104)



Model Number: WDS-750 bga repair system Brand Name: Wisdomshow ( WDS ) Key Specifications/Special Features: Optical alignments BGA rework machine WDS-750 auto pick and place for all kinds of motherboardWDS-750 specifications:1. Touchscreen with a human interface, heating time, heating temperature, reflow temperature rate, advanced alarming, vacuum time all can set the touch screen, simple operation, easily learn2. PLC imports from Japan, temperature control module use China famous brand, display three temperature curves, 4 pieces independent temperature sensor, which can measure the different place temperature of the chips, make sure the rework rate BGA repair machine3. Three independent heating temperature zone, each heating temperature zone can independently set the heating temperature, heating time, rate, six heating temperature sections, simulate the reflow oven heating mode preheating, constant, warming, soldering, reflow soldering, cooling bga repair system4. Auto feed chips, pick up chips, blowing chips, auto recognition chips place during alignment Multifunction mode weld, remove, mount, manual, realize semi-auto and auto function, meet customer’s requirements5. High precision K-type closed loop import from the USA together with our company special heating way, the soldering range of temperature within±1 degree bga repair system6. Imported optical alignment system with 15’’high definition monitor, high-precision micrometer adjust X/Y/R axis, make sure the alignment precision within 0.01-0.02mm7. Top heater and mounting heater design 2-in-1 which can make the mounting more precision, there are many sizes of BGA nozzles which can meet different chips sizes, BGA nozzles can easy change, we accept customize8. High automatic and precision, completely avoid human operation error; it is good for reworking lead-free craft and double BGA, QFN, QFP, capacitance-type resistor components which can achieve a good result9. Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result (optional function)BGA repair system
Total power Max 6800W
Up and down heater power 1200W
IR heater power 4200W (2400W control)
Power supply (single phase) 220V AC ±10/50Hz
Positioning ways optical lens+V-shaped holder+laser positioning
Temperature control high precisionK-shaped sensor (closed loop), up and down independent temperature heating zone, precision can reach ±1°C
Material high sensitive touchscreen+temperature control module+PLC+step drive
PCB size max: 500*450mm, min 10*10mm
PCB thickness 0.5-8mm
Thermo-couple ports 4 pieces
Chips magnification times 2-30
PCB thickness 0.5-8mm
BGA size 0.8-8cm
Min chips pitch 0.15mm
Mounting BGA weight 1000g
Mounting precision ±0.01mm
Overall dimensions (L) 670 x (W) 780 x (H) 850mm
Optical alignment lens motor drive can move front back right left
Weight of machine about 90kg
Products main user repairing shops and factory to provide the after-sales service and rework
Shipping Information:
  • FOB Port: Shenzhen,HK
  • Lead Time: 1 - 3 days
  • HTS Code: 8515.80.90 90
  • Dimensions per Unit: 81 × 86 × 100 Centimeters
  • Weight per Unit: 140 Kilograms
  • Units per Export Carton: 1
  • Export Carton Dimensions L/W/H: 81 × 86 × 100 Centimeters
  • Export Carton Weight: 140 Kilograms
Main Export Markets:
  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe

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